Publications
2025
- Honglin Shu, Dong Wang, Antonio Mastropaolo, Gabriele Bavota, Yasutaka Kamei. “An Empirical Study on Language Models for Generating Log Statements in Test Code” ACM Transactions on Software Engineering and Methodology, 2025
- Honglin Shu, Michael Fu, Junji Yu, Dong Wang, Chakkrit Tantithamthavorn, Junjie Chen, Yasutaka Kamei. “Large Language Models for Multilingual Vulnerability Detection: How Far Are We?” Preprint, 2025
- Dong Wang, Junji Yu, Honglin Shu, Michael Fu, Chakkrit Tantithamthavorn, Yasutaka Kamei, Junjie Chen. “On the Evaluation of Large Language Models in Multilingual Vulnerability Repair” ACM Transactions on Software Engineering and Methodology, 2025
- Kazuki Kusama, Honglin Shu, Masanari Kondo, Yasutaka Kamei. “How Small is Enough? Empirical Evidence of Quantized Small Language Models for Automated Program Repair” ESEIW, 2025
2024
- Zhao Tian, Honglin Shu, Dong Wang, Xuejie Cao, Yasutaka Kamei, and Junjie Chen. “Large Language Models for Equivalent Mutant Detection: How Far are We?” 33rd ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA), To Appear, 2024. (ACM SIGSOFT Distinguished Paper Award)
- Olivier Nourry, Yutaro Kashiwa, Weiyi Shang, Honglin Shu, and Yasutaka Kamei. “My Fuzzer Won’t Build: An Empirical Study of Fuzzing Build Failures” ACM Transactions on Software Engineering and Methodology (TOSEM), To Apper, 2024.
2023
- Honglin Shu, Fu-Lai Chung, and Da Lin. “MetaGC-MC: A Graph-based Meta-learning Approach to Cold-start Recommendation with/without Auxiliary Information.” Information Sciences, Vol. 623: 791-811, 2023.
- Honglin Shu, Pei Gao, Lingwei Zhu, Zheng Chen, Yasuko Matsubara, and Yasushi Sakurai. “Drugs Resistance Analysis from Scarce Health Records via Multi-task Graph Representation.” In International Conference on Advanced Data Mining and Applications (ADMA), pp. 103-117. 2023.
2022
- Honglin Shu, Pei Gao, Ziwei Yang, Chen Li, and Man Wu. “Exploring the Feasibility of Transformer Based Models on Question Relatedness.” In 2022 IEEE 24th Int Conf on High Performance Computing & Communications (HPCC), pp. 831-838. IEEE, 2022.
